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- Adchem Corp. Develops New 7400 Series Transfer Adhesive Designed for Foam Bonding to Challenging Surfaces
- EDEM 2.1 Provides Advanced Particle Simulation Capabilities
- DuPont Microcircuit Materials Introduces New Offering for Printed Electronics
Silver Conductive Ink
- Richardson Electronics Provides Gore EMI Shielding Materials
- New Lexan Thermoclear Sheet Features Thermal Insulation for Glazing, Reduces Energy Costs
- US Navy Places Order For TineLok Vibration-Proof Fasteners in Thermo-Plastic Material
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- Thermos Introduces New Hydration Bottle Made with Eastman Tritan Copolyester
- Admet MTESTQuattro Combines Micro EP Mechanical Test Results with Microscope Image Data
- Sound Idea: Heavy Metal Thunder, By Way of Lightweight Plastic
- Adchem’s Variety of Acrylic and Rubber Based Transfer Tapes on 12-pt Board Liner Assists Converters and End Users
- Metcar High Temperature Materials for Bearings Applications
- Ansys Polyflow 3.12 Enables Improved Manufacturing Engineering Simulationi Virtual Prototyping
- Delo opens office in Taiwan
- CPS Awarded Cooperative Agreement with Army Research Laboratory for Armor Development
- Saint-Gobain Technical Fabrics Announces Launch of New Web Site
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- Fastener Thread Form Offers Critical Thread Locking, New Electrical Design Options
- Creative Materials Introduces Conductive Inks and Adhesives for Thin Film Photovoltaic Cells
- ZeonorFilm Optical Film Offers Improved Touchscreen Application Performance
- PEM China Zinc Plating Line Approved by General Motors
- Global Market for Metal and Ceramic Injection Molding Worth $2.7 Billion by 2014
- PowerMetal Technologies, Inc. Closes Investment Agreement and Signs Exclusive Alliance with DuPont Engineering Polymers
- Reichhold Unveils Strategy for China Composites Market with Plans for Resin Plant in Tianjin
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- CPS Technologies Offers AlSiC Metal Matrix Composite Assemblies for Hermetic Packaging Applications
- Gerber Technology Introduces DCS3600
- Walton Plastics Adds Flexible Polyurethane to PVC Product Line
- New Line of High Performance Gap Fillers Meets Customer Need for Various Levels of Conductivity and Compression Force
- Global Market for Inorganic Metal Finishing Worth $61.1 Billion by 2013
- ACC Issues Polyurethane Rigid Foam Market Survey Report
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- Fast and Accurate Sensor Film Maps Surface Pressure Distribution for Leading Load Cell Manufacturer
- DuPont Microcircuit Materials Introduces New Solamet PV159 for Photovoltaic Solar Cells
- Quadrant EPP Introduces New Advanced Material for Electronics Test Applications
- Asymtek’s New DispenseJet DJ-9500 is up to 10 Times Faster than Needle Dispensers in High-Volume Underfill and LED Silicone Applications
- Printed Electronics Materials to Surpass $11 billion ($US) by 2015, Says New NanoMarkets Report
- American Peptide Company to be Acquired by Otsuka Chemical Company
- Ticona Increases Prices Worldwide
- PPG Acquires Coatings Manufacturer Vanex, Inc.
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- Short Lead-Times for MEMS Programmable Clock Oscillators Help Electronics Manufacturers Gain Traction during Challenging Times
- Tyco Electronics Announces New NBCCS Cabling Materials
- Dow Corning 732 Multi-Purpose Sealant Excels in Industrial Sealing of Plastics
- Metcar Babbitt Bearing Materials for Elevated Temperatures up to 350°F
- University of Illinois Develops MicroNano Testing Device
- PANalytical Launches SuperQ Thin Film and Solar Cell Analysis Solutions
- Yamaha Motors and Shonan Unitech Select VX CAD/CAM
- Nano-Proprietary, Inc. Announces New Trading Symbol
- Bekaert Announces Intention to Sell its Diamond-Like Carbon Coating Activities
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- Nanowire Mesh Can Absorb up to 20 Times its Weight in Oil
- Electrically Conductive Adhesive for Silicone and Florinated Surfaces
- Unifin Offers ForZair Mobile Transformer Oil Coolers
- Admet Introduces MTESTQuattro
- Innovative Polymers Introduces New Line of Thermoplastic-like Polyurethanes Based on Advanced Crosslinked Technologies
- Koch Knight Introduces KryptoKnight Inert Ceramic Support Media for Pocessing and Refining Industries
- The Danish National Advanced Technology Foundation supports LM Glasfiber's New Blade Technology
- Nano-Proprietary, Inc. and NanoReady LTD. Announce Alliance to Commercialize Metallic Nanoparticles
- Global Market for Nanotechnology Slated for High Growth through 2013
- AmberWave Systems Acquires Pasadena-Based Caltech Spinout Company, Aonex Technologies
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- Angstron Introduces Nanomaterial Solution to Meet Market Demand for Next Generation Products
- PolyOne’s Gravi-TechTM and Therma-TechTM Aid in Metal to Plastics Conversions
- Arnold Umformtechnik: Aluminium Replaces Steel
- Global Market for Sputtering Targets and Sputtered Films Slated for High Growth Through 2012
- Unidym, Inc. Announces the First Flight of an Aircraft Using Carbon Nanotubes for Increased Fuselage Strength
- Global Solar Energy Selected by The Dow Chemical Company as Key Team Member in Developing Energized Building Products
- Sticky Nanotubes Hold Key to Future Technologies
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- Novagard Solutions Announces RTV 800 Series UV/Dual Cure and RTV 800 Series UV Gels for Potting, Encapsulating and Conformal Coating Applications
- Henkel Corp. Releases New Corrosion-Resistant Base Coating for Light Metals
- Bordeaux Introduces New Versatile Plasma PlFx UV Ink, New Light Solvent Prime PrJ3 Ink, ‘Mix & Match’ + ‘Plug & Play’ Approach
- Ticona Introduces New UV Weatherable RiteFlex TPC-ET for Monofilaments Used in Interior and Exterior Products
- Thermal Management and Technology Symposium 2008 to Include Materials Workshop
- Nanocomp Technologies Awarded Small Business Innovation Research (SBIR) Contract from US Air Force
- Boston College, MIT Researchers Achieve Increase in Thermoelectric Efficiency
- Creative Materials Introduces Fast-Curing Conductive Epoxy Adhesives
- Carpenter Expands Powder Capabilities with Acquisition of Ultrafine Powder Technology, Inc.
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March 2008 |
- New Temperature/Humidity Monitoring Tools Available for Engineers
- Athena Announces Availability of Two New Alarm Options for IMP, RMB and RMC Series Hot Runner Controls for Injection Molding
- ExxonMobil Chemical Introduces New Cold Insert Nylon Bonding Santoprene TPVs
- Martin Engineering Expands Use of EDEM Software in Design of Solids Handling Equipment
- New aluminum-rich alloy produces hydrogen on-demand for large-scale uses
- BASF raises ethylhexylamine prices
- Indium Corporation’s Chicago Materials Division Earns ISO-9001:2000 Certification
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- Labsphere’s Diffuse Reflectance Materials and Coatings Increase Medical Imaging Performance
- Safely Negotiating the Curves: Bosch Filigree Steering-Angle Sensors Made with Ultradur High Speed
- CPS Technologies Offers TO-250 Series Type Packages
- New Cost Effective, Space Saving, Dual Zone Temperature Controller for Runnerless Molding Applications
- Arlon launches 91ML, a Thermally Conductive Multilayerable, Epoxy Laminate and Prepreg
- Webcom Presents Multiple Industries Patent Workshop
- QuantumSphere Awards Research Grant to Iowa State University to Improve Food Safety with Nanomaterials
- Graham Corp. Wins $1.8 Million Order for Coal-to-Liquid Project in China
- Morgan Crucible Company Agrees to Acquire Carpenter Technology Corp.’s Technical Ceramics Business for $147 Million
- US Market for Advanced Materials and Technologies for Public Works Infrastructure Projects Worth $12 Billion by 2012
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- Metal Filler Prepares Parts for Powder Coating
- Silicone Solution Runs Audible on Earplug Scrap/Tear Issue
- Wireless Data Logger Now Available to Engineers Monitoring Temperature and Humidity
- Smaller is Stronger, Now Scientists Know Why
- Global Market for Intelligent Wireless Microsystems Slated for High Growth Through 2012
- Huber Announces Price Increases for its Specialty Grade Silica and Silicates
- BASF Raises Prices for Ethyleneamines
- Sartomer Company Increases Monomer and Oligomer Prices
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