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e-Report
April 2008 |
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Product News
- Novagard Solutions Announces RTV 800 Series UV/Dual Cure and RTV 800 Series UV Gels for Potting, Encapsulating and Conformal Coating Applications
- Henkel Corp. Releases New Corrosion-Resistant Base Coating for Light Metals
- Bordeaux Introduces New Versatile Plasma PlFx UV Ink, New Light Solvent Prime PrJ3 Ink, ‘Mix & Match’ + ‘Plug & Play’ Approach
- Ticona Introduces New UV Weatherable RiteFlex TPC-ET for Monofilaments Used in Interior and Exterior Products
Industry News
- Thermal Management and Technology Symposium 2008 to Include Materials Workshop
- Nanocomp Technologies Awarded Small Business Innovation Research (SBIR) Contract from US Air Force
- Boston College, MIT Researchers Achieve Increase in Thermoelectric Efficiency
- Creative Materials Introduces Fast-Curing Conductive Epoxy Adhesives
- Carpenter Expands Powder Capabilities with Acquisition of Ultrafine Powder Technology, Inc.
Event Listing
- 2008 Magnetics Conference
May 15-16
Denver, Colo.
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| Sponsored Announcement - Click here to have your company featured! |
Webcom Presents Multiple Industries Patent Workshop
~ at the 2008 Magnetics Conference in Denver, Colo., May 14, 2008 ~
Half Day Workshop:
Intellectual Property Issues for New Product Development
May 14, 2008 (1 p.m. to 5 p.m.) - Beverages and Course Materials Provided
The workshop will start with an overview of the various types of intellectual property, including patents, trademark, copyrights, trade secrets, non-competes and publishing. It will feature a detailed discussion of patents, including type of patents, what is patentable, patent laws and rules, the patenting process and patent strategy. Also covered will be the integration of the patenting process with the new product development process and discussion of critical patent strategy issues. It will conclude with a practical training session for writing technical disclosures for patenting purposes.
For more details about what attendees can expect to learn from this workshop click here.
• Register April 4, 2008 - $395 • Register after April 4, 2008 - $495
Register Now! |
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| PRODUCT NEWS |
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Novagard Solutions Announces RTV 800 Series UV/Dual Cure and RTV 800 Series UV Gels for Potting, Encapsulating and Conformal Coating Applications
Novagard Solutions, a manufacturer of advanced silicone-based adhesives, sealants and lubricants has announced additions to its RTV 800 Series UV/Dual cure and RTV 800 Series UV Gels for use in potting, encapsulating, and conformal coatings applications including delicate electronic components, printed circuit boards, lighting designs and various wiring/current carrying electrical devices.
The RTV 800 Series UV/Dual (UV/Moisture) cure materials can lead to improved profits based on higher productivity and throughput. Novagard Solutions has developed these products with cure speeds of less than three seconds. The fast cure allows the end user more production floor space and flexibility because of a reduced racking requirement.
The unique chemistry allows paste-like products to cure up to a 5/8-inch thick with minimal energy requirements. While this is dramatic in the lab, the onsite results with our customer evaluations have indicated significant time savings during actual production testing.
The physical properties can be varied including the viscosity of encapsulant types from a few hundred centipoises for spraying and dip coating to several thousand for thick coating and deeper potting applications up to 3/8-inch thick. The self-leveling characteristic of these flowable materials and the moisture cure feature allow for shadow curing at room temperature.
The RTV 800 Series UV Gels offer two different products of varying hardness with well suited electrical properties. With cure speeds of less than three seconds and potting opportunities up to ¼-inch in thickness, these gel materials are ideal for encapsulating and staking sensitive electronic components for fast and simple production processes.
The Novagard Solutions RTV 800 Series UV/Dual cure patented technology is based on silicone chemistry, and thus exhibits the well suited physical properties found in silicones such as thermal stability, moisture and weather resistance and resistance to color change. These translucent materials will not degrade or yellow on long-term exposure to light. The RTV 800 Series UV/Dual cure products are a 100 percent silicone reactive system.
Whether users select a self-leveling flowable material, paste, or a gel, they can be stored at ambient temperature without refrigeration. Since they are 100 percent silicone solids, there are no solvents to handle or report based on local restrictions.
The RTV 800 Series UV/Dual cure products continue to build strength after the initial UV cure cycle. The early set from UV exposure eliminates the need to rack parts or develop a time dependant rotation for complex continuous manufacturing campaigns.
Henkel Corp. Releases New Corrosion-Resistant Base Coating for Light Metals
For light metal substrates, Henkel Corp. has developed a new multifunctional base coating, Alodine EC2 ElectroCeramic Coating, designed to provide exceptional chemical, corrosion, temperature and abrasion resistance while reducing parts processing costs. This high temperature–resistant coating is designed to extend the life of parts exposed to harsh operating conditions, delivering titanium ceramic toughness and durability on lower cost substrates.
Based on titanium electrodeposited oxides, Alodine EC2 readily coats aluminum, aluminum alloys, titanium and titanium alloys, as well as aluminized, aluminum-plated and IVD aluminum substrate. The coating is also suitable for aluminized ferrous materials. This new base coating can improve the corrosion resistance and performance of marine engines, automotive powertrain and components, appliances, cookware and a variety of other industrial parts exposed to moisture, fuel, oil and other environmental contaminants.
The coating offers a hardness of 800 vickers, yet is extremely flexible. The coating provides an excellent base for paints, adhesives, sealants and thermal spray coatings. With this product, traditional cleaning and shot blast preparation are no longer required prior to thermal spray application. Alodine EC2 dramatically improves the adhesion of sprayed materials.
Bordeaux Introduces New Versatile Plasma PlFx UV Ink, New Light Solvent Prime PrJ3 Ink, ‘Mix & Match’ + ‘Plug & Play’ Approach
Bordeaux Digital PrintInk Inc. has released its new line of optimal UV inks. Already offering UV Curing inks for flatbed applications, Bordeaux has expanded its plasma (UV) inks product range to include other common substrates for graphic arts such as Plastic (polypropylene) Sheet. Bordeaux’s newly developed PlFx, part of the plasma ink family, adheres perfectly to all substrates commonly used throughout the large and grand format digital graphics industry, as well as flexible materials.
Bordeaux also introduced its new Prime PRJ3 Match Series, designed to interact seamlessly with the printer. “Our new PRJ3 match series is fully compatible with Mimaki SS2TM OEM ink but with unique added value; it has been formulated with a color gamut so close to OEM ink, that there is no need to perform profiling,” said Erez Shoshani, director at Bordeaux Digital PrintInk Inc. “This ink is strictly ‘Plug and Play,’ eliminating flushing and the need to change pumps and tubing. The PRJ3 Match Series can be ‘Mixed and Matched’ with OEM ink, meaning, that there is no need to throw away partial or unused OEM ink. Converting is quick and inexpensive and the ink’s fast drying time and high density prints also allow for high speed printing. From indoor posters to outdoor signs with 6 colors, the PRJ3 Match Series make even the most creative choices available to the sign maker.”
Printing has been made easier and more cost effective with a new type of ink suitable for rigid and flatbed applications, as well as flexible substrates for roll-to-roll UV printers. By providing one unified and versatile ink, Bordeaux can support more market niches while enabling printers to save both time and money. Printers will no longer need to switch from one ink type to the next or, use more than one type of ink on different printing machines.
“With the invention of this new, unique ink, Bordeaux customers will for the first time, be able to ‘Mix & Match’ colors using OEM inks interchangeably with Bordeaux inks to maximize ink consumption,” said Moshe Zach, Bordeaux’s CEO. “In addition, Bordeaux’s ‘Plug & Play’ range will eliminate the need to calibrate the printer when changing to Bordeaux inks. We hope that our new line of products will revolutionize the way printers work with inks.”
Ticona Introduces New UV Weatherable RiteFlex TPC-ET for Monofilaments Used in Interior and Exterior Products
Ticona Engineering Polymers has introduced its new UV-stabilized Riteflex thermoplastic polyester elastomer (TPC-ET) for monofilaments. It represents an ultraviolet (UV) and weathering solution for office furniture, auto interior and outdoor products that must stand up to the harsh abuse of light and weathering.
Riteflex UV655M TPC-ET is part of a new family of UV stabilized Riteflex grades that Ticona engineered for specific applications, from interior automotive to animal tags to exterior films and fabrics.
Riteflex UV655M TPC-ET for monofilaments, multi-filaments and nonwovens provides in excess of 85 percent property retention for color and elongation at UV exposures of as much as 2,000 kJ/m2, twice the industry standard, tested according to SAE J1960 in several colors including black. As a result, product manufacturers can use these new monofilaments to create long-lasting fabrics for auto seating, outdoor furniture and other applications exposed to sunlight. In addition, Riteflex UV655M TPC-ET is available in a wide range of standard colors and custom color matching can be performed to match any specific color.
“Countless manufactured products can’t stand up to UV and weathering abuse,” said Bruce Mulholland, the color technology manager for Ticona. “For example, today’s suspension office chairs can discolor and rapidly lose some of their ductility in today’s open, sun-drenched offices. Or injection molded hose fittings and cables corrode and crack when used outdoors. This new UV product can help overcome these issues.”
Unlike conventional copolyester elastomers (COPE), Riteflex UV stabilized grades of TPC-ET with their special stabilization systems provide protection in both interior and exterior products. For example: UV Riteflex grades shields fabric chair arms from UV induced fading; resist fading and cracking in automotive interior parts — even metallic satin chrome finishes; stand up to weathering extremes in injection molded animal tags, hose fittings and cables for exterior use; and offer advanced UV/weathering to products from exterior seating to trampolines and thin films to cables.
Riteflex TPC-ETs deliver the desirable properties of thermoset elastomers with the processing ease of thermoplastics and combine toughness, tear and flex fatigue resistance with the ability to perform over a wide temperature range. They also offer the chemical resistance of polyesters to common solvents, oils and greases and dilute acids and bases. |
| INDUSTRY NEWS |
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Thermal Management and Technology Symposium 2008 to Include Materials Workshop
Webcom Communications has announced a new pre-conference workshop for Thermal Management and Technology Symposium 2008. Dr. Carl Zweben, and advanced thermal materials consultant will lead the workshop Ultrahigh-Thermal-Conductivity Packaging Materials.
The full-day conference will begin at 8 a.m. on Sept. 24 at the Hyatt Regency Austin, in Austin Texas. Lunch will be provided.
Attendees will learn about heat dissipation, thermal stresses and warping are critical microelectronic and optoelectronic packaging problems. In response, suppliers are developing an increasing number of high-performance thermal management materials. This full-day course provides an in-depth discussion of the increasing number of ultrahigh-thermal-conductivity and other advanced materials. Topics include properties, manufacturing processes, applications, cost, lessons learned, and future directions, including carbon nanotubes, thermal interface materials and low-CTE solders. Traditional materials are included for reference.
Dr. Carl Zweben, now an independent consultant on composites and advanced thermal materials, was for many years Advanced Technology Manager and Division Fellow at GE Astro Space, which was acquired by Lockheed Martin. He directed the Composites Center of Excellence of the seventeen-department GE Aerospace Group, and led the Lockheed Martin Space and Strategic Missiles Sector Composite Structures Center of Excellence Team. Dr. Zweben has more than 40 years of commercial and aerospace experience in polymer matrix-, metal matrix-, ceramic matrix- and carbon/carbon composite materials technology, including: design, manufacturing, product development, material development and characterization, test method development, material and structural testing and basic research in micromechanics and material behavior. He also has served as an expert witness. Dr. Zweben is a Life Fellow of ASME International (the American Society of Mechanical Engineers), a Fellow of ASM International (formerly the American Society for Materials) and the Society for the Advancement of Material and Process Engineering (SAMPE), an Associate Fellow of the American Institute of Aeronautics and Astronautics, and a Life Member of the American Society of Civil Engineers.
Click here to register!
Nanocomp Technologies Awarded Small Business Innovation Research (SBIR) Contract from US Air Force
Nanocomp Technologies, Inc., developer of energy-saving performance materials and component products, has been awarded a Phase One contract by the US Air Force under the Department of Defense’s Small Business Innovation Research (SBIR) program. The intent of this SBIR project is to develop a new generation of very lightweight, electrically conductive wires, cables and materials made from carbon nanotubes (CNTs). Under Phase One, Nanocomp Technologies will expand upon its current processing and manufacturing methods for producing CNT sheets and spun conductors, composed of long-length CNTs, to surpass established electrical performance standards required by aerospace to replace traditional copper wiring.
Copper wiring is used in electronic harnesses because of its proven history and well suited electrical conductivity. However, in modern aerospace systems, wiring deficiencies are becoming more apparent as functional demands increase. For example, today’s large satellites weighing 15 tons or more derive one-third of their weight from copper wiring harnesses. Similarly in commercial aircraft, a Boeing 747 uses as much as 135 miles of copper wire and weighs more than 4,000 lbs. Copper wires also oxidize and corrode, are susceptible to vibration fatigue and create premature electronics failures due to overheating conditions.
Nanocomp Technologies’ carbon nanotubes feature a long length, up to one millimeter. As a result, the company’s products are more conductive in end applications as compared to short, powder-like nanotubes appearing in today’s market.
In early 2008, Nanocomp began producing large CNT sheets that not only demonstrate value for a number of aerospace and electronics applications, but also will integrate directly into existing manufacturing processes in those industries.
The SBIR program is funded by 12 federal agencies from their Research and Development budgets. It is designed to simultaneously stimulate technological innovation among private sector small businesses such as Nanocomp Technologies and increase the commercialization of new technology through federal R&D.
Boston College, MIT Researchers Achieve Increase in Thermoelectric Efficiency
Researchers at Boston College and MIT have used nanotechnology to achieve a major increase in thermoelectric efficiency, a milestone that paves the way for a new generation of products, from semiconductors and air conditioners to car exhaust systems and solar power technology, which run cleaner.
The team's low-cost approach involves building tiny alloy nanostructures that can serve as micro-coolers and power generators. The researchers said that in addition to being inexpensive, their method will likely result in practical, near-term enhancements to make products consume less energy or capture energy that would otherwise be wasted.
The findings represent a key milestone in the quest to harness the thermoelectric effect, which has both enticed and frustrated scientists since its discovery in the early 19th century. The effect refers to certain materials that can convert heat into electricity and vice versa. But there has been a hitch in trying to exploit the effect: most materials that conduct electricity also conduct heat, so their temperature equalizes quickly. In order to improve efficiency, scientists have sought materials that will conduct electricity but not similarly conduct heat.
Using nanotechnology, the researchers at BC and MIT produced a big increase in the thermoelectric efficiency of bismuth antimony telluride, a semiconductor alloy that has been commonly used in commercial devices since the 1950s, in bulk form. Specifically, the team realized a 40 percent increase in the alloy's figure of merit, a term scientists use to measure a material's relative performance.
The achievement marks the first such gain in a half-century using the cost-effective material that functions at room temperatures and up to 250°C. The success using the relatively inexpensive and environmentally friendly alloy in bulk form means the discovery can quickly be applied to a range of uses, leading to higher cooling and power generation efficiency.
“By using nanotechnology, we have found a way to improve an old material by breaking it up and then rebuilding it in a composite of nanostructures in bulk form,” said Boston College physicist Zhifeng Ren, one of the leaders of the project. “This method is low-cost and can be scaled for mass production. This represents an exciting opportunity to improve the performance of thermoelectric materials in a cost-effective manner.”
“These thermoelectric materials are already used in many applications, but this better material can have a bigger impact,” said Gang Chen, the Warren and Towneley Rohsenow professor of mechanical engineering at MIT and another leader of the project.
At its core, thermoelectricity is the “hot and cool” issue of physics. Heating one end of a wire, for example, causes electrons to move to the cooler end, producing an electric current. In reverse, applying a current to the same wire will carry heat away from a hot section to a cool section. Phonons, a quantum mode of vibration, play a key role because they are the primary means by which heat conduction takes place in insulating solids.
Bismuth antimony telluride is a material commonly used in thermoelectric products, and the researchers crushed it into a nanoscopic dust and then reconstituted it in bulk form, albeit with nanoscale constituents. The grains and irregularities of the reconstituted alloy dramatically slowed the passage of phonons through the material, radically transforming the thermoelectric performance by blocking heat flow while allowing the electrical flow.
In addition to Ren and six researchers at his BC lab, the international team involved MIT researchers, including Chen and Mildred S. Dresselhaus, institute professor; research scientist Bed Poudel at GMZ Energy, Inc., a Newton, Mass.-based company formed by Ren, Chen, and CEO Mike Clary; as well as BC visiting Professor Junming Liu, a physicist from Nanjing University in China.
Thermoelectric materials have been used by NASA to generate power for far-away spacecraft. These materials have been used by specialty automobile seat makers to keep drivers cool during the summer. The auto industry has been experimenting with ways to use thermoelectric materials to convert waste heat from a car exhaust systems into electric current to help power vehicles.
The research was supported by the Department of Energy and by the National Science Foundation.
Creative Materials Introduces Fast-Curing Conductive Epoxy Adhesives
Creative Materials, Inc, a manufacturer of electrically conductive ink, coating and adhesives, has introduced a new line of fast-curing conductive epoxy adhesives. 124-34A/B-187 is a two-component syringe dispensable, isotropically electrically conductive, epoxy adhesive. 125-01A/B-187 is a two-component syringe dispensable, anisotropically conductive version of this product.
Both of these systems feature well-suited thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include assembling electrical and electronic components. Examples include smart card and RFID chip bonding. Cure times as fast as seven to 10 seconds can be achieved with these products at elevated temperatures.
Carpenter Expands Powder Capabilities with Acquisition of Ultrafine Powder Technology, Inc.
Carpenter Technology Corp.’s Carpenter Powder Products subsidiary has acquired UltraFine Powder Technology, Inc., a private company.
UltraFine Powder, which operates a single facility in Woonsocket, R.I., manufactures and sells fine gas atomized powders for the metal injection molding (MIM) industry and other specialty markets. |
| EVENT LISTINGS |
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One Month Until the 2008 Magnetics Conference
This two-day conference is a leading global event within the magnetics market, bringing together worldwide magnetics experts. This is a once-a-year opportunity for professionals in the magnetics market to assemble and discuss the latest magnetics developments.
The 2008 Magnetics Conference will focus on the latest advancements in magnetic applications, technology and materials. Serving OEM developers of products that utilize magnets and magnet systems, design engineers, OEM developers involved in EMC technology and magnetic effects, magnetics manufacturers and integrators, and material suppliers in the magnetics industry. Registration is $995.
Attend the 2008 Magnetics Conference to see industry-leading companies such as:
Advanced Magnet Lab, Alliance LLC, AR, Big Horn Valve, Inc., CMS Magnetics, Crane Aerospace & Electronics, Daido Electronics Co., Ltd., Dexter Magnetic Technologies, Electron Energy Corp., GMW Associates, Hitachi Metals, Ltd., Infolytica Corp., Magnequench International, Inc., Magnetic Power, Inc., MAGSYS magnet systems, Metrolab Technology, National Institute of Standards and Technology, Ozenbaugh Engineering, PolarisREM, LLC, Quadrant Technology, Rensselaer Polytechnic Institute, SuperPower, Inc., TarnoTek, Vector Fields Ltd., Walter T. Benecki LLC, WebMagnetics, Inc., West Coast Magnetics
Register Now!
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| JOB LISTINGS |
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| Upcoming Industry Events - Click HERE to view our full Calendar of Events |
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April 2008
14-16 Composites Manufacturing 2008, Salt Lake City, Utah
19-24 2008 51st SVC Annual Technical Conference, Chicago, Ill.
22-23 NanoManufacturing Conference & Exhibits, Framingham, Mass.
28-30 3D/SiP Advanced Packaging Symposium, Durham, N.C.
SEMICON West 2008
July 15-17
San Francisco, Calif.
SEMICON West 2008–Infinite Innovations, Infinite Ideas SEMICON West is the place to see the companies, technologies, and people driving the future of micro design and manufacturing. No other event this year has more new products, more new technologies, and more solutions than SEMICON West.
From the latest developments in cutting-edge materials, to the systems and technologies driving semiconductor designs to the limits of Moore's Law, you'll find everything and everyone in the industry at SEMICON West.
Registration is now open! Plan now to participate and get ready to discover the infinite opportunities shaping the design and manufacture of semiconductors, MEMS, photovoltaics, flexible electronics, and more!
For more information, visit www.semiconwest.org.
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